Display of processed parts

Widely used for cutting and processing of various conductive, semi - conductive and non - conductive brittle materials, such as graphite, semiconductor materials, semiconductor material wafers,full - color metal glass, ceramics, artificial crystals, composite materials, magnetic materials, optical materials, natural stone, new building materials,thermal insulation materials, coated glass, jade, agate, etc. Brittle materials with Mohs hardness of 7.2 or less are all within the scope of cutting and processing.